LP2902N/NOPB
vs
LMC6574BIM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
SOIC
Package Description
DIP-14
PLASTIC, SOP-14
Pin Count
14
14
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.04 µA
0.00001 µA
Bias Current-Max (IIB) @25C
0.02 µA
0.00001 µA
Common-mode Reject Ratio-Min
80 dB
57 dB
Common-mode Reject Ratio-Nom
90 dB
75 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
10000 µV
7500 µV
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
JESD-609 Code
e3
e0
Length
19.18 mm
8.65 mm
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.75 mm
Slew Rate-Nom
0.05 V/us
0.09 V/us
Supply Current-Max
0.25 mA
0.28 mA
Supply Voltage Limit-Max
26 V
12 V
Supply Voltage-Nom (Vsup)
5 V
2.7 V
Surface Mount
NO
YES
Technology
BIPOLAR
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
30
Unity Gain BW-Nom
100
220
Voltage Gain-Min
40000
500000
Width
7.62 mm
3.9 mm
Base Number Matches
3
2
Low-Bias
YES
Slew Rate-Min
0.01 V/us
Compare LP2902N/NOPB with alternatives
Compare LMC6574BIM with alternatives