LMX9838SBX
vs
LMX9838SBX
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
LGA,
|
LGA, LGA70(UNSPEC)
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PBGA-N70
|
R-PBGA-N70
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
70
|
70
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LGA
|
LGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
250
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.1 mm
|
2.1 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
LGA
|
| Pin Count |
|
70
|
| Package Equivalence Code |
|
LGA70(UNSPEC)
|
| Supply Current-Max |
|
0.065 mA
|
| Technology |
|
CMOS
|
|
|
|