LMX9830SM/NOPB
vs
LMX9830SMX/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
LFBGA, BGA60,6X10,32
|
9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, FBGA-60
|
| Pin Count |
60
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8517.62.00.20
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Rate |
921 Mbps
|
|
| JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
| JESD-609 Code |
e1
|
e1
|
| Length |
9 mm
|
9 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
60
|
60
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA60,6X10,32
|
BGA60,6X10,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.3 mm
|
1.3 mm
|
| Supply Current-Max |
0.065 mA
|
0.065 mA
|
| Supply Voltage-Nom |
2.75 V
|
2.75 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LMX9830SM/NOPB with alternatives
Compare LMX9830SMX/NOPB with alternatives