LMX9830SM/NOPB
vs
LMX9830SMX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Package Description
LFBGA, BGA60,6X10,32
LFBGA,
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
e0
Length
9 mm
9 mm
Moisture Sensitivity Level
4
3
Number of Functions
1
1
Number of Terminals
60
60
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA60,6X10,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.3 mm
1.3 mm
Supply Current-Max
0.065 mA
Supply Voltage-Nom
2.75 V
2.75 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
6 mm
6 mm
Base Number Matches
2
2
Part Package Code
BGA
Pin Count
60
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