LMV7219M7X/NOPB
vs
RHF801K1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
STMICROELECTRONICS
|
| Part Package Code |
SC-70
|
DFP
|
| Package Description |
SC-70, 5 PIN
|
DFP,
|
| Pin Count |
5
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
2 µA
|
|
| Bias Current-Max (IIB) @25C |
0.95 µA
|
|
| Input Offset Voltage-Max |
8000 µV
|
7000 µV
|
| JESD-30 Code |
R-PDSO-G5
|
S-CDFP-F8
|
| JESD-609 Code |
e3
|
|
| Length |
2 mm
|
6.48 mm
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Type |
PUSH-PULL
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TSSOP
|
DFP
|
| Package Equivalence Code |
TSSOP5/6,.08
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Response Time-Nom |
12 ns
|
11 ns
|
| Seated Height-Max |
1.1 mm
|
2.64 mm
|
| Supply Current-Max |
2.4 mA
|
|
| Supply Voltage Limit-Max |
5.5 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
1.25 mm
|
6.48 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare LMV7219M7X/NOPB with alternatives
Compare RHF801K1 with alternatives