RHF801K1
vs
LMV7219M7
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
STMICROELECTRONICS
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
DFP
|
SC-70
|
Package Description |
DFP,
|
SC-70, 5 PIN
|
Pin Count |
8
|
5
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Input Offset Voltage-Max |
7000 µV
|
8000 µV
|
JESD-30 Code |
S-CDFP-F8
|
R-PDSO-G5
|
Length |
6.48 mm
|
2 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
5
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DFP
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Response Time-Nom |
11 ns
|
12 ns
|
Seated Height-Max |
2.64 mm
|
1.1 mm
|
Supply Voltage Limit-Max |
6 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BIPOLAR
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
Width |
6.48 mm
|
1.25 mm
|
Base Number Matches |
1
|
2
|
Average Bias Current-Max (IIB) |
|
2 µA
|
Bias Current-Max (IIB) @25C |
|
0.95 µA
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
1
|
Neg Supply Voltage Limit-Max |
|
|
Neg Supply Voltage-Nom (Vsup) |
|
|
Output Type |
|
PUSH-PULL
|
Package Equivalence Code |
|
TSSOP5/6,.08
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
2.4 mA
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare RHF801K1 with alternatives
Compare LMV7219M7 with alternatives