RHF801K1 vs LMV7219M7 feature comparison

RHF801K1 STMicroelectronics

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LMV7219M7 National Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer STMICROELECTRONICS NATIONAL SEMICONDUCTOR CORP
Part Package Code DFP SC-70
Package Description DFP, SC-70, 5 PIN
Pin Count 8 5
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Input Offset Voltage-Max 7000 µV 8000 µV
JESD-30 Code S-CDFP-F8 R-PDSO-G5
Length 6.48 mm 2 mm
Number of Functions 1 1
Number of Terminals 8 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DFP TSSOP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Response Time-Nom 11 ns 12 ns
Seated Height-Max 2.64 mm 1.1 mm
Supply Voltage Limit-Max 6 V 5.5 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology BICMOS BIPOLAR
Temperature Grade MILITARY INDUSTRIAL
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 6.48 mm 1.25 mm
Base Number Matches 1 2
Average Bias Current-Max (IIB) 2 µA
Bias Current-Max (IIB) @25C 0.95 µA
JESD-609 Code e0
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Output Type PUSH-PULL
Package Equivalence Code TSSOP5/6,.08
Qualification Status Not Qualified
Supply Current-Max 2.4 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare RHF801K1 with alternatives

Compare LMV7219M7 with alternatives