LMC668ACN-8
vs
TLC2654ACJG
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
CHOPPER-STAB
CHOPPER-STAB
Average Bias Current-Max (IIB)
0.00006 µA
0.00015 µA
Bias Current-Max (IIB) @25C
0.00006 µA
0.00015 µA
Common-mode Reject Ratio-Nom
125 dB
125 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
5 µV
24 µV
JESD-30 Code
R-PDIP-T8
R-GDIP-T8
JESD-609 Code
e0
Length
9.8171 mm
9.6 mm
Low-Bias
YES
YES
Low-Offset
YES
YES
Micropower
NO
NO
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Nom
2.5 V/us
2 V/us
Supply Current-Max
3.5 mA
2.2 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
1000
1900
Wideband
NO
NO
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Slew Rate-Min
1.3 V/us
Supply Voltage Limit-Max
8 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Gain-Min
3162000
Compare LMC668ACN-8 with alternatives
Compare TLC2654ACJG with alternatives