LMC6464AIMX
vs
M38510/11001BCX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
DIP
Package Description
SOIC-14
DIP,
Pin Count
14
14
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.00001 µA
0.325 µA
Bias Current-Max (IIB) @25C
0.00001 µA
Common-mode Reject Ratio-Min
67 dB
Common-mode Reject Ratio-Nom
74 dB
Frequency Compensation
YES
Input Offset Voltage-Max
2000 µV
6000 µV
JESD-30 Code
R-PDSO-G14
R-CDIP-T14
JESD-609 Code
e0
Length
8.65 mm
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TAPE AND REEL
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Slew Rate-Min
0.008 V/us
Slew Rate-Nom
0.023 V/us
Supply Current-Max
0.07 mA
Supply Voltage Limit-Max
16 V
22 V
Supply Voltage-Nom (Vsup)
3 V
15 V
Surface Mount
YES
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Unity Gain BW-Nom
50
Width
3.9 mm
Base Number Matches
2
1
Compare LMC6464AIMX with alternatives
Compare M38510/11001BCX with alternatives