LMC6062IN/NOPB
vs
TLV2252CP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
ROHS COMPLIANT, DIP-8
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.000004 µA
0.001 µA
Common-mode Reject Ratio-Min
63 dB
Common-mode Reject Ratio-Nom
85 dB
75 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
1300 µV
1000 µV
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
Length
9.817 mm
9.59 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Min
0.007 V/us
0.05 V/us
Slew Rate-Nom
35000 V/us
0.1 V/us
Supply Current-Max
0.066 mA
0.15 mA
Supply Voltage Limit-Max
16 V
16 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
100
187
Voltage Gain-Min
35000
10000
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Bias Current-Max (IIB) @25C
0.00006 µA
Compare LMC6062IN/NOPB with alternatives
Compare TLV2252CP with alternatives