LM75AIM
vs
TCN75-5.0MUA713
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Not Recommended
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
SOP8,.25
|
TSSOP8,.19
|
Reach Compliance Code |
compliant
|
compliant
|
Accuracy-Max (Cel) |
3 Cel
|
3 Cel
|
Body Breadth |
3.9 mm
|
3 mm
|
Body Height |
1.55 mm
|
1 mm
|
Body Length or Diameter |
4.9 mm
|
3 mm
|
Housing |
PLASTIC
|
PLASTIC
|
JESD-609 Code |
e3
|
e3
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Bits |
9
|
9
|
Number of Terminals |
8
|
8
|
Operating Current-Max |
0.28 mA
|
0.25 mA
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Equivalence Code |
SOP8,.25
|
TSSOP8,.19
|
Package Shape/Style |
RECTANGULAR
|
SQUARE
|
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
10
|
1
|
Pbfree Code |
|
Yes
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Factory Lead Time |
|
5 Weeks
|
Date Of Intro |
|
1999-06-01
|
Samacsys Manufacturer |
|
Microchip
|
Temperature Coefficient |
|
POSITIVE ppm/°C
|
|
|
|
Compare LM75AIM with alternatives
Compare TCN75-5.0MUA713 with alternatives