LM75ADP,118 vs LM75CIM-3/NOPB feature comparison

LM75ADP,118 NXP Semiconductors

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LM75CIM-3/NOPB Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code TSSOP
Package Description 3 MM, PLASTIC, TSSOP-8
Pin Count 8
Manufacturer Package Code SOT505-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01
Factory Lead Time 34 Weeks, 3 Days
Samacsys Manufacturer NXP
Accuracy-Max (Cel) 3 Cel 3 Cel
Additional Feature THERMAL WATCHDOG
Body Breadth 3 mm 3.9 mm
Body Height 1.1 mm 1.72 mm
Body Length or Diameter 3 mm 4.89 mm
Housing PLASTIC PLASTIC
JESD-609 Code e4 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Bits 11 9
Number of Terminals 8
Operating Current-Max 1 mA 1 mA
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Interface Type 2-WIRE INTERFACE 2-WIRE INTERFACE
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSSOP8,.19
Package Shape/Style SQUARE RECTANGULAR
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.8 V 3 V
Surface Mount YES YES
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN
Termination Type SOLDER SOLDER
Base Number Matches 1 3
Pbfree Code Yes

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