LM75AD,112
vs
TCN75-3.3MOA
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
3.9 MM, MS-012, PLASTIC, SO-8
|
SOIC-8
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
SOT96-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
Microchip
|
| Accuracy-Max (Cel) |
3 Cel
|
3 Cel
|
| Additional Feature |
THERMAL WATCHDOG
|
|
| Body Breadth |
3.9 mm
|
3.9 mm
|
| Body Height |
1.75 mm
|
1.72 mm
|
| Body Length or Diameter |
4.9 mm
|
4.89 mm
|
| Housing |
PLASTIC
|
PLASTIC
|
| JESD-609 Code |
e4
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Bits |
11
|
9
|
| Number of Terminals |
8
|
8
|
| Operating Current-Max |
1 mA
|
0.25 mA
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape/Style |
RECTANGULAR
|
RECTANGULAR
|
| Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.8 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Coefficient |
NEGATIVE/POSITIVE ppm/°C
|
POSITIVE ppm/°C
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Matte Tin (Sn)
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
6
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
25 Weeks
|
| Date Of Intro |
|
1997-09-10
|
|
|
|
Compare LM75AD,112 with alternatives
Compare TCN75-3.3MOA with alternatives