LM6161J-QMLV
vs
LM6218AJ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-8
CERAMIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
6 µA
0.95 µA
Bias Current-Max (IIB) @25C
3 µA
0.35 µA
Common-mode Reject Ratio-Nom
80 dB
100 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
10000 µV
2500 µV
JESD-30 Code
R-GDIP-T8
R-GDIP-T8
JESD-609 Code
e0
e0
Low-Offset
NO
NO
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-20 V
Number of Functions
1
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
RAIL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Min
180 V/us
30 V/us
Slew Rate-Nom
300 V/us
75 V/us
Supply Current-Max
6.8 mA
7.5 mA
Supply Voltage Limit-Max
18 V
21 V
Supply Voltage-Nom (Vsup)
15 V
20 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
50000
17000
Voltage Gain-Min
300
30000
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
Common-mode Reject Ratio-Min
75 dB
Micropower
NO
Compare LM6161J-QMLV with alternatives
Compare LM6218AJ with alternatives