LM6161J-QMLV
vs
LP324N/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-8
DIP-14
Pin Count
8
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
6 µA
0.02 µA
Bias Current-Max (IIB) @25C
3 µA
0.01 µA
Common-mode Reject Ratio-Nom
80 dB
90 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
10000 µV
9000 µV
JESD-30 Code
R-GDIP-T8
R-PDIP-T14
JESD-609 Code
e0
e3
Low-Offset
NO
NO
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
1
4
Number of Terminals
8
14
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
RAIL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Min
180 V/us
Slew Rate-Nom
300 V/us
0.05 V/us
Supply Current-Max
6.8 mA
0.25 mA
Supply Voltage Limit-Max
18 V
32 V
Supply Voltage-Nom (Vsup)
15 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
50000
100
Voltage Gain-Min
300
50000
Width
7.62 mm
7.62 mm
Base Number Matches
2
3
Common-mode Reject Ratio-Min
80 dB
Length
19.18 mm
Micropower
YES
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare LM6161J-QMLV with alternatives
Compare LP324N/NOPB with alternatives