LM6161J-QMLV vs 5962-8964701PX feature comparison

LM6161J-QMLV National Semiconductor Corporation

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5962-8964701PX Defense Logistics Agency

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP DEFENSE LOGISTICS AGENCY
Part Package Code DIP
Package Description CERAMIC, DIP-8 DIP-8
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 6 µA 7.5 µA
Bias Current-Max (IIB) @25C 3 µA
Common-mode Reject Ratio-Nom 80 dB 95 dB
Frequency Compensation YES
Input Offset Voltage-Max 10000 µV 4000 µV
JESD-30 Code R-GDIP-T8 R-GDIP-T8
JESD-609 Code e0
Low-Offset NO
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method RAIL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Min 180 V/us 120 V/us
Slew Rate-Nom 300 V/us 300 V/us
Supply Current-Max 6.8 mA 8.4 mA
Supply Voltage Limit-Max 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 50000 50000
Voltage Gain-Min 300 1500
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Common-mode Reject Ratio-Min 80 dB
Micropower NO
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 5962-8964701PX with alternatives