LM555J/883
vs
LM555CJ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
CERAMIC, DIP-8
DIP, DIP8,.3
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
PULSE; RECTANGULAR
PULSE; RECTANGULAR
JESD-30 Code
R-CDIP-T8
R-GDIP-T8
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Frequency-Max
0.051 MHz
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
16 V
Supply Voltage-Min (Vsup)
5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Supply Current-Max (Isup)
15 mA
Compare LM555J/883 with alternatives
Compare LM555CJ with alternatives