LM555J/883 vs MC1455BP1G feature comparison

LM555J/883 National Semiconductor Corporation

Buy Now Datasheet

MC1455BP1G Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Package Description CERAMIC, DIP-8 PLASTIC, DIP-8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 Code R-CDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Frequency-Max 0.051 MHz
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified COMMERCIAL
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 15 V 16 V
Supply Voltage-Min (Vsup) 5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code DIP
Pin Count 8
Length 9.78 mm

Compare LM555J/883 with alternatives