LM5111-1MYX/NOPB
vs
LM5111-1MYX
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
HTSSOP,
|
MSOP-8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
OVER VOLTAGE
|
OVER VOLTAGE
|
| Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SOURCE AND SINK
|
SOURCE AND SINK
|
| Output Peak Current Limit-Nom |
5 A
|
5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
HTSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.09 mm
|
1.09 mm
|
| Supply Voltage-Max |
14 V
|
14 V
|
| Supply Voltage-Min |
3.5 V
|
3.5 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare LM5111-1MYX/NOPB with alternatives
Compare LM5111-1MYX with alternatives