LM5111-1MY/NOPB
vs
LM5111-1MYX/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Reach Compliance Code
compliant
compliant
JESD-30 Code
R-PDSO-G8
S-PDSO-G8
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Terminals
8
8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HTSSOP
Package Equivalence Code
TSSOP8,.19
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Technology
BICMOS
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Base Number Matches
2
2
Package Description
HTSSOP,
ECCN Code
EAR99
HTS Code
8542.39.00.01
Built-in Protections
OVER VOLTAGE
Interface IC Type
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Length
3 mm
Number of Functions
1
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Output Current Flow Direction
SOURCE AND SINK
Output Peak Current Limit-Nom
5 A
Seated Height-Max
1.09 mm
Supply Voltage-Max
14 V
Supply Voltage-Min
3.5 V
Temperature Grade
AUTOMOTIVE
Width
3 mm
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