LM4051BIM3-1.2+T
vs
LM4051CIM3X-1.2/NOPB
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOT-23
|
|
Package Description |
TSSOP,
|
TSOP, TO-236
|
Pin Count |
3
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Length |
2.92 mm
|
2.92 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Voltage-Max |
1.2275 V
|
1.2351 V
|
Output Voltage-Min |
1.2226 V
|
1.2149 V
|
Output Voltage-Nom |
1.225 V
|
1.225 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSOP
|
Package Equivalence Code |
TO-236
|
TO-236
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.12 mm
|
1.12 mm
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BIPOLAR
|
Temp Coef of Voltage-Max |
50 ppm/°C
|
50 ppm/°C
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.953 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Trim/Adjustable Output |
NO
|
NO
|
Width |
1.3 mm
|
1.3 mm
|
Base Number Matches |
1
|
2
|
Voltage Tolerance-Max |
|
0.5%
|
|
|
|
Compare LM4051BIM3-1.2+T with alternatives
Compare LM4051CIM3X-1.2/NOPB with alternatives