LM4050BIM3-4.1/NOPB
vs
LM4040BIM3X-4.1/NOPB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
3 X 1.30 MM, PLASTIC, TO-236-AB, SOT-23, 3 PIN
|
PLASTIC, TO-236AB, SOT-23, 3 PIN
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Length |
2.92 mm
|
2.92 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Voltage-Max |
4.118 V
|
4.131 V
|
Output Voltage-Min |
4.074 V
|
4.061 V
|
Output Voltage-Nom |
4.096 V
|
4.096 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSOP
|
Package Equivalence Code |
TO-236
|
TO-236
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.12 mm
|
1.12 mm
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temp Coef of Voltage-Max |
50 ppm/°C
|
100 ppm/°C
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Trim/Adjustable Output |
NO
|
NO
|
Voltage Tolerance-Max |
0.5%
|
0.2%
|
Width |
1.3 mm
|
1.3 mm
|
Base Number Matches |
2
|
2
|
Supply Current-Max (Isup) |
|
0.068 mA
|
|
|
|
Compare LM4050BIM3-4.1/NOPB with alternatives
Compare LM4040BIM3X-4.1/NOPB with alternatives