LM3S9D92-IQC80-A2T
vs
LM3S9D92-IBZ80-A1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
QFP
BGA
Package Description
LFQFP, QFP100,.63SQ,20
LFBGA,
Pin Count
100
108
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
CPU Family
CORTEX-M3
Clock Frequency-Max
16.384 MHz
16.384 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-PQFP-G100
S-PBGA-B108
Length
14 mm
10 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of DMA Channels
32
Number of I/O Lines
65
65
Number of Terminals
100
108
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFBGA
Package Equivalence Code
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
RAM (bytes)
98304
RAM (words)
100352
ROM (words)
524288
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.5 mm
Speed
80 MHz
80 MHz
Supply Current-Max
210 mA
Supply Voltage-Max
1.365 V
1.365 V
Supply Voltage-Min
1.3 V
1.235 V
Supply Voltage-Nom
1.3 V
1.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
14 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
2
Compare LM3S9D92-IQC80-A2T with alternatives
Compare LM3S9D92-IBZ80-A1 with alternatives