LM3S6633-IQC50-A2
vs
LM3S1110-IBZ25-A2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
QFP
BGA
Package Description
GREEN, MS-026BED, LQFP-100
GREEN, MO-219F, BGA-108
Pin Count
100
108
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Clock Frequency-Max
0.032 MHz
0.032 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G100
S-PBGA-B108
JESD-609 Code
e3
e1
Length
14 mm
10 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
41
41
Number of Terminals
100
108
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFBGA
Package Equivalence Code
QFP100,.63SQ,20
BGA108,12X12,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
32768
16384
ROM (words)
131072
65536
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.5 mm
Speed
50 MHz
25 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.5 V
2.5 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
14 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Compare LM3S6633-IQC50-A2 with alternatives
Compare LM3S1110-IBZ25-A2 with alternatives