LM3S1110-IBZ25-A2
vs
LM3S6633-EQC50-A2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
QFP
Package Description
GREEN, MO-219F, BGA-108
LFQFP, QFP100,.63SQ,20
Pin Count
108
100
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Clock Frequency-Max
0.032 MHz
0.032 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PBGA-B108
S-PQFP-G100
JESD-609 Code
e1
Length
10 mm
14 mm
Moisture Sensitivity Level
3
Number of I/O Lines
41
41
Number of Terminals
108
100
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFQFP
Package Equivalence Code
BGA108,12X12,32
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
16384
32768
ROM (words)
65536
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.5 mm
1.6 mm
Speed
25 MHz
50 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.5 V
2.5 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
10 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Pbfree Code
Samacsys Manufacturer
Texas Instruments
Boundary Scan
NO
Compare LM3S1110-IBZ25-A2 with alternatives
Compare LM3S6633-EQC50-A2 with alternatives