LM3S1N11-IBZ50-C1T vs LM3S1N11-IBZ50-C5T feature comparison

LM3S1N11-IBZ50-C1T Texas Instruments

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LM3S1N11-IBZ50-C5T Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA
Package Description LFBGA, BGA108,12X12,32 LFQFP, BGA108,12X12,32
Pin Count 108
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 0.032 MHz 16.384 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-PBGA-B108 S-PQFP-G100
Length 10 mm 14 mm
Number of I/O Lines 67 67
Number of Terminals 108 100
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFQFP
Package Equivalence Code BGA108,12X12,32 BGA108,12X12,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 12288 12288
ROM (words) 65536 65536
ROM Programmability FLASH FLASH
Seated Height-Max 1.5 mm 1.6 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 1.32 V 1.365 V
Supply Voltage-Min 1.2 V 1.3 V
Supply Voltage-Nom 1.2 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 10 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Pbfree Code No
Samacsys Manufacturer Texas Instruments
CPU Family CORTEX-M3
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

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