LM3S1N11-IBZ50-C5T
vs
LM3S1J11-IBZ50-C3T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
LFQFP, BGA108,12X12,32
LFBGA, BGA108,12X12,32
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
NO
NO
CPU Family
CORTEX-M3
Clock Frequency-Max
16.384 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PQFP-G100
S-PBGA-B108
JESD-609 Code
e1
Length
14 mm
10 mm
Moisture Sensitivity Level
3
Number of I/O Lines
67
67
Number of Terminals
100
108
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFBGA
Package Equivalence Code
BGA108,12X12,32
BGA108,12X12,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
12288
20480
ROM (words)
65536
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.5 mm
Speed
50 MHz
50 MHz
Supply Voltage-Max
1.365 V
3.6 V
Supply Voltage-Min
1.3 V
3.3 V
Supply Voltage-Nom
1.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
14 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
108
Compare LM3S1N11-IBZ50-C5T with alternatives
Compare LM3S1J11-IBZ50-C3T with alternatives