LM3S1N11-IBZ50-C1T
vs
LM3S1N11-IBZ50-C3T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA108,12X12,32
LFBGA, BGA108,12X12,32
Pin Count
108
108
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
0.032 MHz
0.032 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B108
S-PBGA-B108
Length
10 mm
10 mm
Number of I/O Lines
67
67
Number of Terminals
108
108
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA108,12X12,32
BGA108,12X12,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
12288
12288
ROM (words)
65536
65536
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.5 mm
1.5 mm
Speed
50 MHz
50 MHz
Supply Voltage-Max
1.32 V
1.32 V
Supply Voltage-Min
1.2 V
1.2 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Pbfree Code
Compare LM3S1N11-IBZ50-C1T with alternatives
Compare LM3S1N11-IBZ50-C3T with alternatives