LM385D-2.5R2
vs
LM385BDM-2.5
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MICROSEMI CORP
|
| Part Package Code |
SOIC-8 Narrow Body
|
SOIC
|
| Package Description |
SOP, SOP8,.25
|
SOP, SOP8,.25
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
751-07
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
4.9 mm
|
4.915 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Voltage-Max |
2.575 V
|
2.538 V
|
| Output Voltage-Min |
2.425 V
|
2.462 V
|
| Output Voltage-Nom |
2.5 V
|
2.5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
235
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn80Pb20)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Trim/Adjustable Output |
NO
|
NO
|
| Voltage Tolerance-Max |
3%
|
1.5%
|
| Width |
3.9 mm
|
3.875 mm
|
| Base Number Matches |
2
|
4
|
| Rohs Code |
|
Yes
|
| Temp Coef of Voltage-Max |
|
20 ppm/°C
|
|
|
|
Compare LM385D-2.5R2 with alternatives
Compare LM385BDM-2.5 with alternatives