LM385BZ-2.5/NOPB
vs
LM385BLP-2.5
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICROSEMI CORP
|
| Package Description |
PLASTIC, TO-92, 3 PIN
|
, SIP3,.1,50
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
O-PBCY-T3
|
O-PBCY-W3
|
| JESD-609 Code |
e2
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Voltage-Max |
2.538 V
|
2.538 V
|
| Output Voltage-Min |
2.462 V
|
2.462 V
|
| Output Voltage-Nom |
2.5 V
|
2.5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TO-92
|
|
| Package Equivalence Code |
SIP3,.1,50
|
SIP3,.1,50
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max (Isup) |
20 mA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
|
| Temp Coef of Voltage-Max |
150 ppm/°C
|
20 ppm/°C
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Copper (Sn/Cu)
|
|
| Terminal Form |
THROUGH-HOLE
|
WIRE
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Trim/Adjustable Output |
NO
|
NO
|
| Voltage Tolerance-Max |
1.52%
|
1.5%
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
TO-92
|
| Pin Count |
|
3
|
|
|
|
Compare LM385BZ-2.5/NOPB with alternatives
Compare LM385BLP-2.5 with alternatives