LM385BYZ
vs
LM385BXZ/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
TO-92, SIP3,.1,50
|
PLASTIC, TO-92, 3 PIN
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ADJUSTABLE FROM 1.24V TO 5.30V
|
ADJUSTABLE FROM 1.24V TO 5.30V
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
O-PBCY-W3
|
O-PBCY-W3
|
| JESD-609 Code |
e0
|
e2
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Voltage-Max |
1.252 V
|
1.252 V
|
| Output Voltage-Min |
1.228 V
|
1.228 V
|
| Output Voltage-Nom |
1.24 V
|
1.24 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TO-92
|
TO-92
|
| Package Equivalence Code |
SIP3,.1,50
|
SIP3,.1,50
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max (Isup) |
0.055 mA
|
0.055 mA
|
| Supply Voltage-Max (Vsup) |
5.3 V
|
5.3 V
|
| Supply Voltage-Min (Vsup) |
1.24 V
|
1.24 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temp Coef of Voltage-Max |
50 ppm/°C
|
30 ppm/°C
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Tin/Copper (Sn/Cu)
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Trim/Adjustable Output |
YES
|
YES
|
| Base Number Matches |
6
|
1
|
|
|
|
Compare LM385BYZ with alternatives
Compare LM385BXZ/NOPB with alternatives