LM361MX vs LM361N/NOPB feature comparison

LM361MX National Semiconductor Corporation

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LM361N/NOPB National Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC DIP
Package Description SOP-14 DIP-14
Pin Count 14 14
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.00003 µA 30 µA
Bias Current-Max (IIB) @25C 0.00003 µA 0.00003 µA
Input Offset Voltage-Max 5000 µV 5000 µV
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e0 e3
Length 8.6235 mm 19.18 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -16 V -16 V
Neg Supply Voltage-Nom (Vsup) -10 V -10 V
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Type TOTEM POLE TOTEM POLE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 235 260
Qualification Status Not Qualified Not Qualified
Response Time-Nom 14 ns 14 ns
Seated Height-Max 1.753 mm 5.08 mm
Supply Voltage Limit-Max 16 V 16 V
Supply Voltage-Nom (Vsup) 10 V 10 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 40
Width 3.9 mm 7.62 mm
Base Number Matches 2 2

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