LM3554TME/NOPB
vs
LM3554TME/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
1.70 X 1.70 MM. 0.60 MM HEIGHT, 0.40 MM PITCH, GREEN, USMD-16
|
1.70 X 1.70 MM. 0.60 MM HEIGHT, 0.40 MM PITCH, LEAD FREE, USMD-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Input Mode |
SERIAL
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-PBGA-B16
|
S-PBGA-B16
|
| JESD-609 Code |
e1
|
e1
|
| Length |
1.6545 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Multiplexed Display Capability |
NO
|
|
| Number of Channels |
2
|
|
| Number of Functions |
1
|
|
| Number of Segments |
2
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-30 °C
|
|
| Output Characteristics |
CONSTANT-CURRENT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.675 mm
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
2.5 V
|
|
| Supply Voltage-Nom |
3.6 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.4 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
1.6545 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|