LM324J/NOPB
vs
M38510/11001BCX
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
14
14
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.5 µA
0.325 µA
Common-mode Reject Ratio-Min
65 dB
Common-mode Reject Ratio-Nom
85 dB
Input Offset Voltage-Max
9000 µV
6000 µV
JESD-30 Code
R-GDIP-T14
R-CDIP-T14
Length
19.43 mm
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Slew Rate-Nom
0.5 V/us
Supply Voltage Limit-Max
32 V
22 V
Supply Voltage-Nom (Vsup)
5 V
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
1000
Voltage Gain-Min
25000
Width
7.62 mm
Base Number Matches
1
1
Compare LM324J/NOPB with alternatives
Compare M38510/11001BCX with alternatives