LM308ANG vs LM108AD feature comparison

LM308ANG onsemi

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LM108AD AMD

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, HERMETIC SEALED, DIP-8
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom 110 dB 110 dB
JESD-30 Code R-PDIP-T8 R-CDIP-T8
Length 9.78 mm 9.779 mm
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -20 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 5.08 mm
Supply Voltage Limit-Max 18 V
Supply Voltage-Nom (Vsup) 15 V 20 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 4
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.003 µA
Frequency Compensation NO
Input Offset Voltage-Max 1000 µV
JESD-609 Code e0
Low-Offset NO
Package Equivalence Code DIP14,.3
Screening Level MIL-STD-883 Class C
Supply Current-Max 0.6 mA
Terminal Finish Tin/Lead (Sn/Pb)

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