LM2903MWA
vs
LMC6772BIN/NOPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
WAFER
DIP
Package Description
DIE, DIE OR CHIP
MDIP-8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
0.5 µA
Bias Current-Max (IIB) @25C
0.25 µA
Input Offset Voltage-Max
15000 µV
18000 µV
JESD-30 Code
X-XUUC-N
R-PDIP-T8
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Type
OPEN-COLLECTOR
OPEN-DRAIN
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
COMMERCIAL
Response Time-Nom
1500 ns
4000 ns
Supply Current-Max
2.5 mA
Supply Voltage Limit-Max
36 V
16 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
BIPOLAR
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
2
3
Pbfree Code
Pin Count
8
JESD-609 Code
e3
Length
9.817 mm
Moisture Sensitivity Level
1
Number of Terminals
8
Peak Reflow Temperature (Cel)
260
Seated Height-Max
5.08 mm
Terminal Finish
TIN
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
7.62 mm
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