LM2726MX
vs
NCP4424DWR2
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Package Description
PLASTIC, SO-8
SOP,
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
High Side Driver
YES
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 Code
R-PDSO-G8
R-PDSO-G16
JESD-609 Code
e0
Length
4.9 mm
10.3 mm
Moisture Sensitivity Level
1
Number of Functions
1
2
Number of Terminals
8
16
Output Peak Current Limit-Nom
3 A
3 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2.65 mm
Supply Voltage-Max
7 V
18 V
Supply Voltage-Min
4 V
4.5 V
Supply Voltage-Nom
5 V
Surface Mount
YES
YES
Technology
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
7.5 mm
Base Number Matches
2
4
Part Package Code
SOIC
Pin Count
16
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Temperature Grade
INDUSTRIAL
Turn-off Time
100 µs
Turn-on Time
100 µs
Compare LM2726MX with alternatives
Compare NCP4424DWR2 with alternatives