LM2660MM/NOPB
vs
LM2660MMX
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
MINI, SO-8
|
TSSOP, TSSOP8,.19
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SWITCHED CAPACITOR CONVERTER
|
SWITCHED CAPACITOR CONVERTER
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
1.5 V
|
1.5 V
|
Input Voltage-Nom |
5 V
|
5 V
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e0
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
0.1 A
|
0.1 A
|
Output Voltage-Max |
11 V
|
11 V
|
Output Voltage-Min |
5 V
|
5 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.09 mm
|
1.09 mm
|
Supply Current-Max (Isup) |
3 mA
|
3 mA
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
DOUBLER INVERTER
|
DOUBLER INVERTER
|
Switching Frequency-Max |
40 kHz
|
40 kHz
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
|
|
|
Compare LM2660MM/NOPB with alternatives
Compare LM2660MMX with alternatives