LM2512ASM
vs
LM2512ASM
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Package Description |
4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, UFBGA-49
|
4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, UFBGA-49
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
S-PBGA-B49
|
S-PBGA-B49
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
49
|
49
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA49,7X7,20
|
BGA49,7X7,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.14 mm
|
1.14 mm
|
Supply Current-Max |
9 mA
|
|
Supply Voltage-Max |
2 V
|
2 V
|
Supply Voltage-Min |
1.6 V
|
1.6 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
3
|
4
|
Part Package Code |
|
BGA
|
Pin Count |
|
49
|
|
|
|
Compare LM2512ASM with alternatives
Compare LM2512ASM with alternatives