LM211N vs JL111BHA feature comparison

LM211N NXP Semiconductors

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JL111BHA National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, MO-001, SC-504, SOT-97, DIP-8 CERAMIC, DFP-10
Pin Count 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.15 µA 0.0001 µA
Bias Current-Max (IIB) @25C 0.01 µA 0.0001 µA
Input Offset Voltage-Max 4000 µV 3000 µV
JESD-30 Code R-PDIP-T8 R-GDFP-F10
Length 9.5 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -18 V -30 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 10
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -25 °C -55 °C
Output Type OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DFP
Package Equivalence Code DIP8,.3 FL10,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Qualification Status Not Qualified Not Qualified
Response Time-Nom 200 ns 300 ns
Seated Height-Max 4.2 mm 2.032 mm
Supply Current-Max 6 mA
Supply Voltage Limit-Max 18 V 30 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade OTHER MILITARY
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 6.12 mm
Base Number Matches 2 1
JESD-609 Code e0
Peak Reflow Temperature (Cel) 260
Screening Level MIL-STD-883
Terminal Finish Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) 40

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