LM201AN
vs
MC33074AD
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
DIP, DIP8,.3
|
SOP,
|
Pin Count |
8
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
0.1 µA
|
0.7 µA
|
Bias Current-Max (IIB) @25C |
0.075 µA
|
|
Common-mode Reject Ratio-Min |
80 dB
|
80 dB
|
Common-mode Reject Ratio-Nom |
96 dB
|
97 dB
|
Frequency Compensation |
NO
|
|
Input Offset Voltage-Max |
3000 µV
|
5000 µV
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
e0
|
Length |
9.78 mm
|
8.65 mm
|
Low-Offset |
NO
|
|
Neg Supply Voltage Limit-Max |
-22 V
|
-22 V
|
Neg Supply Voltage-Nom (Vsup) |
-20 V
|
-15 V
|
Number of Functions |
1
|
4
|
Number of Terminals |
8
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP8,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.45 mm
|
1.75 mm
|
Supply Current-Max |
3 mA
|
11.2 mA
|
Supply Voltage Limit-Max |
22 V
|
22 V
|
Supply Voltage-Nom (Vsup) |
20 V
|
15 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
1000
|
4500
|
Voltage Gain-Min |
50000
|
25000
|
Width |
7.62 mm
|
3.9 mm
|
Base Number Matches |
1
|
3
|
Slew Rate-Min |
|
8 V/us
|
Slew Rate-Nom |
|
10 V/us
|
|
|
|
Compare LM201AN with alternatives
Compare MC33074AD with alternatives