LM185H-2.5/NOPB
vs
LM185BYH-1.2
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
HERMETIC SEALED, METAL CAN, TO-46, 2 PIN
|
HERMETIC SEALED, METAL CAN, TO-46, 2 PIN
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ADJUSTABLE FROM 1.24V TO 5.30V
|
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
O-MBCY-W2
|
O-MBCY-W2
|
| JESD-609 Code |
e1
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Voltage-Max |
1.255 V
|
1.247 V
|
| Output Voltage-Min |
1.215 V
|
1.223 V
|
| Output Voltage-Nom |
1.24 V
|
1.235 V
|
| Package Body Material |
METAL
|
METAL
|
| Package Code |
TO-46
|
TO-46
|
| Package Equivalence Code |
SIP2,.1
|
SIP2,.1
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max (Isup) |
20 mA
|
0.01 mA
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temp Coef of Voltage-Max |
150 ppm/°C
|
50 ppm/°C
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Lead (Sn63Pb37)
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Trim/Adjustable Output |
YES
|
NO
|
| Voltage Tolerance-Max |
1.52%
|
1%
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LM185H-2.5/NOPB with alternatives
Compare LM185BYH-1.2 with alternatives