LM185BYH-2.5
vs
LM4050BIM3-2.5/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
HERMETIC SEALED, METAL CAN, TO-46, 2 PIN
|
TSSOP, TO-236
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
O-MBCY-W2
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Voltage-Max |
2.538 V
|
2.514 V
|
| Output Voltage-Min |
2.462 V
|
2.486 V
|
| Output Voltage-Nom |
2.5 V
|
2.5 V
|
| Package Body Material |
METAL
|
PLASTIC/EPOXY
|
| Package Code |
TO-46
|
TSSOP
|
| Package Equivalence Code |
SIP2,.1
|
TO-236
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max (Isup) |
20 mA
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temp Coef of Voltage-Max |
50 ppm/°C
|
50 ppm/°C
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Matte Tin (Sn)
|
| Terminal Form |
WIRE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.95 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Trim/Adjustable Output |
NO
|
NO
|
| Voltage Tolerance-Max |
1.52%
|
0.5%
|
| Base Number Matches |
2
|
3
|
| Length |
|
2.92 mm
|
| Seated Height-Max |
|
1.12 mm
|
| Width |
|
1.3 mm
|
|
|
|
Compare LM185BYH-2.5 with alternatives
Compare LM4050BIM3-2.5/NOPB with alternatives