LM108AP vs LM308AN feature comparison

LM108AP Texas Instruments

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LM308AN Motorola Semiconductor Products

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC MOTOROLA INC
Part Package Code DIP
Package Description DIP, DIP8,.3 PLASTIC, DIP-8
Pin Count 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.002 µA 0.01 µA
Bias Current-Max (IIB) @25C 0.002 µA 0.007 µA
Common-mode Reject Ratio-Min 96 dB 96 dB
Common-mode Reject Ratio-Nom 96 dB 110 dB
Frequency Compensation NO NO
Input Offset Voltage-Max 500 µV 730 µV
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.81 mm 9.78 mm
Low-Offset NO YES
Neg Supply Voltage Limit-Max -20 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Slew Rate-Nom 0.2 V/us
Supply Current-Max 0.6 mA 0.8 mA
Supply Voltage Limit-Max 20 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 1000 1000
Voltage Gain-Min 80000 60000
Width 7.62 mm 7.62 mm
Base Number Matches 1 13
JESD-609 Code e0
Low-Bias NO
Micropower YES
Power NO
Programmable Power NO
Terminal Finish Tin/Lead (Sn/Pb)
Wideband NO

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