LH53B16P00BN vs MSM531602CGS-K feature comparison

LH53B16P00BN Sharp Corp

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MSM531602CGS-K LAPIS Semiconductor Co Ltd

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SHARP CORP LAPIS SEMICONDUCTOR CO LTD
Package Description SOP-44
Reach Compliance Code unknown unknown
Access Time-Max 120 ns 120 ns
Additional Feature CONFIGURABLE AS 1M X 16
JESD-30 Code R-PDSO-G44 R-PDSO-G44
Length 28.2 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 16
Number of Functions 1
Number of Terminals 44 44
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode ASYNCHRONOUS
Organization 2MX8 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.15 mm
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 13.2 mm
Base Number Matches 1 2
Rohs Code No
ECCN Code EAR99
HTS Code 8542.32.00.71
Alternate Memory Width 8
JESD-609 Code e0
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code SOP44,.63
Standby Current-Max 0.00005 A
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)

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