LH538R00BSR vs K3N4C3000D-GC12 feature comparison

LH538R00BSR Sharp Corp

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K3N4C3000D-GC12 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SHARP CORP SAMSUNG SEMICONDUCTOR INC
Package Description 0.400 INCH, PLASTIC, REVERSE, TSOP2-32 SOP, SOP32,.56
Reach Compliance Code unknown compliant
Access Time-Max 120 ns 120 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0 e0
Length 21 mm 20.47 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX8 1MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2-R SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3 mm
Supply Current-Max 0.06 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 10.2 mm 11.43 mm
Base Number Matches 1 1
Part Package Code SOIC
Pin Count 32
ECCN Code EAR99
HTS Code 8542.32.00.71
Additional Feature TTL COMPATIBLE I/O
Package Equivalence Code SOP32,.56
Standby Current-Max 0.00005 A

Compare LH538R00BSR with alternatives

Compare K3N4C3000D-GC12 with alternatives