LH538P00AN-12 vs KM23C8100HG-12 feature comparison

LH538P00AN-12 Sharp Corp

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KM23C8100HG-12 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SHARP CORP SAMSUNG SEMICONDUCTOR INC
Package Description 0.600 INCH, PLASTIC, SOP-44 SOP, SOP44,.63
Reach Compliance Code unknown compliant
Access Time-Max 120 ns 120 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
Length 28.2 mm 28.5 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.25 mm 3.1 mm
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 13.2 mm 12.6 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code SOIC
Pin Count 44
ECCN Code EAR99
HTS Code 8542.32.00.71
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code SOP44,.63
Standby Current-Max 0.00005 A
Terminal Finish TIN LEAD

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Compare KM23C8100HG-12 with alternatives