LFXP2-5E-6MN132C
vs
LFXP2-5E-6M132C
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Pin Count |
132
|
132
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Lattice Semiconductor
|
|
Clock Frequency-Max |
435 MHz
|
435 MHz
|
Combinatorial Delay of a CLB-Max |
0.399 ns
|
0.399 ns
|
JESD-30 Code |
S-PBGA-B132
|
S-PBGA-B132
|
JESD-609 Code |
e1
|
e0
|
Length |
8 mm
|
8 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
625
|
|
Number of Inputs |
86
|
86
|
Number of Logic Cells |
5000
|
5000
|
Number of Outputs |
86
|
86
|
Number of Terminals |
132
|
132
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
625 CLBS
|
625 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA132,14X14,20
|
BGA132,14X14,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.35 mm
|
1.35 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
Package Description |
|
8 X 8 MM, CSBGA-132
|
|
|
|
Compare LFXP2-5E-6MN132C with alternatives
Compare LFXP2-5E-6M132C with alternatives