LFXP2-5E-6M132C
vs
LFXP2-5E-6M132I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
8 X 8 MM, CSBGA-132
8 X 8 MM, CSBGA-132
Pin Count
132
132
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
435 MHz
435 MHz
Combinatorial Delay of a CLB-Max
0.399 ns
0.399 ns
JESD-30 Code
S-PBGA-B132
S-PBGA-B132
JESD-609 Code
e0
e0
Length
8 mm
8 mm
Moisture Sensitivity Level
3
3
Number of Inputs
86
86
Number of Logic Cells
5000
5000
Number of Outputs
86
86
Number of Terminals
132
132
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
625 CLBS
625 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA132,14X14,20
BGA132,14X14,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
240
240
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.35 mm
1.35 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
8 mm
8 mm
Base Number Matches
1
1
Samacsys Manufacturer
Lattice Semiconductor
Compare LFXP2-5E-6M132C with alternatives
Compare LFXP2-5E-6M132I with alternatives