LFXP2-17E-5FTN256C vs LFXP2-17E-5FT256C8W feature comparison

LFXP2-17E-5FTN256C Lattice Semiconductor Corporation

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LFXP2-17E-5FT256C8W Lattice Semiconductor Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Lattice Semiconductor
Clock Frequency-Max 435 MHz 311 MHz
Combinatorial Delay of a CLB-Max 0.494 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2125
Number of Inputs 201 201
Number of Logic Cells 17000 17000
Number of Outputs 201 201
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2125 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 1 1
Package Description 17 X 17 MM, FTBGA-256
Time@Peak Reflow Temperature-Max (s) 30

Compare LFXP2-17E-5FTN256C with alternatives

Compare LFXP2-17E-5FT256C8W with alternatives