LFE3-17EA-6MG328I
vs
LFE3-17EA-7LMG328C
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Pin Count |
328
|
328
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Lattice Semiconductor
|
|
Clock Frequency-Max |
2645 MHz
|
2932 MHz
|
Combinatorial Delay of a CLB-Max |
0.379 ns
|
0.335 ns
|
JESD-30 Code |
S-PBGA-B328
|
S-PBGA-B328
|
JESD-609 Code |
e1
|
e1
|
Length |
10 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
2125
|
2125
|
Number of Inputs |
116
|
116
|
Number of Logic Cells |
17000
|
17000
|
Number of Outputs |
116
|
116
|
Number of Terminals |
328
|
328
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
2125 CLBS
|
2125 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA328,19X19,20
|
BGA328,19X19,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
1
|
1
|
Temperature Grade |
|
OTHER
|
|
|
|
Compare LFE3-17EA-6MG328I with alternatives
Compare LFE3-17EA-7LMG328C with alternatives